Solderless, High-Density Multiport Interconnects

 

Rosenberger’s SMPX interconnects are solderless, high-density multiport systems designed for frequencies up to 110 GHz. These compression-mounted connectors support 10,000+ mating cycles and feature field-replaceable channels, allowing individual replacements instead of full assembly swaps. With 54 mm pitch, channel pair skew within 1 ps, and tighter matching available, SMPX is ideal for semiconductor development, ATE, probe cards, data center testing, and defense systems. RFMW featured product at #IMS2025.

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© beam-Verlag Dipl.-Ing. Reinhard Birchel